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| MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) September 2007 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Features High isolation voltage tm Description The MOC811XM series consists of a Gallium Arsenide IRED coupled with an NPN phototransistor. The base of the transistor is not bonded to an external pin for improved noise immunity. 7500 VAC Peak--1 second High BVCEO minimum 70 Volts Current transfer ratio in selected groups: MOC8111M: 20% min. MOC8112M: 50% min. MOC8113M: 100% min. Maximum switching time in saturation specified Underwriters Laboratory (UL) recognized (File #E90700, Vol. 2) IEC60747-5-2 approved (ordering option V) Applications Power supply regulators Digital logic inputs Microprocessor inputs Appliance sensor systems Industrial controls Packages Schematic ANODE 1 6 6 1 1 6 N/C CATHODE 2 5 COLLECTOR N/C 3 6 4 EMITTER 1 (c)2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Absolute Maximum Ratings (TA = 25C Unless otherwise specified.) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol TOTAL DEVICE PD TOPR TSTG TSOL INPUT LED IF IF(pk) VR PD Forward Current - Continuous Forward Current - Peak (PW = 1s, 300pps) Reverse Voltage LED Power Dissipation @ TA = 25C Derate above 25C OUTPUT TRANSISTOR PD Detector Power Dissipation @ TA = 25C Derate above 25C 200 2.67 mW mW/C 90 3 6 135 1.8 mA A V mW mW/C Total Device Power Dissipation @ TA = 25C Derate above 25C Ambient Operating Temperature Range Storage Temperature Range Lead Soldering Temperature (Wave Solder) (1/16" from case, 10 sec. duration) 260 3.5 -40 to +100 -40 to +150 260 mW mW/C C C C Parameter Value Unit (c)2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 2 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Electrical Characteristics (TA = 25C Unless otherwise specified.) Individual Component Characteristics Symbol EMITTER VF VR CJ IR BVCEO BVECO ICEO CCE Input Forward Voltage Reverse Voltage Capacitance Reverse Leakage Current Breakdow Voltage, Collector to Emitter Breakdow Voltage, Emitter to Collector Leakage Current, Collector to Emitter Capacitance, Collector to Emitter IF = 60mA IF = 10mA IR = 10A VF = 0V, f = 1.0MHz VF = 1V, f = 1.0MHz VR = 3.0V IC = 1.0mA, IF = 0 IE = 100A, IF = 0 VCE = 10V, IF = 0 VCE = 0 V, f = 1MHz 70 7 5 8 50 DETECTOR V V V pF 6.0 1.35 1.15 15 50 65 .35 10 A 1.65 1.50 V pF V Parameter Test Conditions Min. Typ. Max. Unit Isolation Characteristics Symbol VISO CISO Characteristic Input-Output Isolation Voltage Isolation Capacitance Test Conditions f = 60Hz, t = 1 sec. VI-O = 0, f = 1MHz Min. 7500 Typ. 0.5 Max. Units VAC(PK) pF Transfer Characteristic Symbol CTR Characteristics Output/Input Current Transfer Ratio Test Conditions IF = 10mA, VCE = 5V Device MOC8111M MOC8112M MOC8113M Min. 20 50 100 Typ. Max. Units % DC CHARACTERISTICS VCE(SAT) Collector-Emitter Saturation Voltage AC CHARACTERISTICS Non-Saturated Switching Times ton toff ton tr toff tf Turn-On Time Turn-Off Time Turn-On Time Rise-Time Turn-Off Time Fall-Time IF = 10mA, IC = 2.5mA All 0.27 0.4 V RL = 100, IC = 2mA, VCC = 10V, See Figure 7 All All MOC8111M MOC812M/3M MOC8111M MOC812M/3M MOC8111M MOC812M/3M MOC8111M MOC812M/3M 6.0 5.5 3.0 4.2 2.0 3.0 18 23 11 14 10 10 5.5 8.0 4.0 6.0 34 39 20 24 s s s s s s Saturated Switching Times IF = 20mA, VCE = 0.4V IF = 10mA, VCE = 0.4V IF = 20mA, VCE = 0.4V IF = 10mA, VCE = 0.4V IF = 20mA, VCE = 0.4V IF = 10mA, VCE = 0.4V IF = 20mA, VCE = 0.4V IF = 10mA, VCE = 0.4V (c)2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 3 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Typical Performance Characteristics Fig. 1 LED Forward Voltage vs. Forward Current 1.8 1.4 TA = 25C VCE = 5.0 V 1.2 Normalized to IF = 10 mA Fig. 2 Normalized CTR vs. Forward Current 1.7 VF - FORWARD VOLTAGE (V) 1.6 1.0 1.5 TA = -55C 1.4 NORMALIZED CTR 100 0.8 0.6 1.3 1.2 TA = 25C 1.1 TA = 100C 1.0 1 10 0.4 0.2 0.0 0 5 10 15 20 IF - LED FORWARD CURRENT (mA) IF - FORWARD CURRENT (mA) 1.6 VCE (sat) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) Fig. 3 Normalized CTR vs. Ambient Temperature Fig. 4 Collector Emitter Saturation Voltage vs Collector Current 100 1.4 IF = 5 mA 10 NORMALIZED CTR 1.2 IF = 10 mA 1.0 1 IF = 2.5 mA 0.1 0.8 IF = 20 mA 0.6 Normalized to IF = 10 mA TA = 25C -50 -25 0 25 50 75 100 125 0.01 IF = 5 mA TA = 25C 0.001 0.01 0.1 1 IF = 10 mA IF = 20 mA 0.4 -75 10 TA - AMBIENT TEMPERATURE (C) IC - COLLECTOR CURRENT (mA) Fig. 5 Switching Speed vs. Load Resistor 1000 IF = 10 mA VCC = 10 V TA = 25C 1e+1 Fig. 6 Dark current vs. Ambient Temperature. ICEO - COLLECTOR-EMITTER DARK CURRENT (A) 1e+0 VCE = 10V SWITCHING SPEED - (s) 100 1e-1 Toff Tf 10 1e-2 1e-3 Ton 1 Tr 1e-4 1e-5 0.1 0.1 1 10 100 1e-6 0 25 50 75 100 125 R-LOAD RESISTOR (k) TA - AMBIENT TEMPERATURE (C) (c)2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 4 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) TEST CIRCUIT VCC = 10V WAVE FORMS INPUT PULSE IF INPUT IC RL = 100 10% 90% tr ton tf toff OUTPUT PULSE OUTPUT Adjust IF to produce IC = 2 mA Figure 7. Switching Time Test Circuit and Waveforms (c)2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 5 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Package Dimensions Through Hole 0.350 (8.89) 0.320 (8.13) Surface Mount 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.260 (6.60) 0.240 (6.10) 0.390 (9.90) 0.332 (8.43) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.200 (5.08) 0.115 (2.93) 0.200 (5.08) 0.115 (2.93) 0.012 (0.30) 0.008 (0.20) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15 0.012 (0.30) 0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.035 (0.88) 0.012 (0.30) 0.4" Lead Spacing 0.350 (8.89) 0.320 (8.13) Recommend Pad Layout for Surface Mount Leadform 0.070 (1.78) 0.060 (1.52) 0.260 (6.60) 0.240 (6.10) 0.425 (10.79) 0.070 (1.77) 0.040 (1.02) 0.100 (2.54) 0.305 (7.75) 0.030 (0.76) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16) Note: All dimensions are in inches (millimeters). (c)2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 6 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Ordering Information Option No Suffix S SR2 T V TV SV SR2V Example Part Number MOC8111M MOC8111SM MOC8111SR2M MOC8111TM MOC8111VM MOC8111TVM MOC8111SVM MOC8111SR2VM Through Hole Description Surface Mount Lead Bend Surface Mount; Tape and Reel 0.4" Lead Spacing VDE 0884 IEC60747-5-2 (VDE), 0.4" Lead Spacing IEC60747-5-2 (VDE), Surface Mount IEC60747-5-2 (VDE), Surface Mount, Tape and Reel Marking Information 1 MOC8111M V 3 4 2 6 X YY Q 5 Definitions 1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code, e.g., `7' Two digit work week ranging from `01' to `53' Assembly package code (c)2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 7 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) Tape Dimensions 12.0 0.1 4.5 0.20 2.0 0.05 0.30 0.05 4.0 0.1 O1.5 MIN 1.75 0.10 11.5 1.0 21.0 0.1 9.1 0.20 24.0 0.3 0.1 MAX 10.1 0.20 O1.5 0.1/-0 User Direction of Feed Note: All dimensions are in millimeters. Reflow Profile 300 280 260 240 220 200 180 Time above 183C = 90 Sec >245C = 42 Sec 260C C 160 140 120 100 80 60 40 20 0 0 60 120 180 33 Sec 1.822C/Sec Ramp up rate 270 360 Time (s) (c)2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 8 MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection) TRADEMARKS The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx(R) Build it NowTM CorePLUSTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R) (R) Fairchild(R) Fairchild Semiconductor(R) FACT Quiet SeriesTM FACT(R) FAST(R) FastvCoreTM FPSTM FRFET(R) Global Power ResourceSM Green FPSTM Green FPSTM e-SeriesTM GTOTM i-LoTM IntelliMAXTM ISOPLANARTM MegaBuckTM MICROCOUPLERTM MicroFETTM MicroPakTM MillerDriveTM Motion-SPMTM OPTOLOGIC(R) OPTOPLANAR(R) (R) PDP-SPMTM Power220(R) Power247(R) POWEREDGE(R) Power-SPMTM PowerTrench(R) Programmable Active DroopTM QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM SMART STARTTM SPM(R) STEALTHTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM The Power Franchise(R) TinyBoostTM TinyBuckTM TinyLogic(R) TINYOPTOTM TinyPowerTM TinyPWMTM TinyWireTM SerDesTM UHC(R) UniFETTM VCXTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I31 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. No Identification Needed Full Production Obsolete Not In Production (c)2007 Fairchild Semiconductor Corporation MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0 www.fairchildsemi.com 9 |
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